Embedded Software Engineer

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Job Summary:

• You will join our multi-disciplinary project teams working on our high-tech assembly systems and equipment for semiconductor manufacturing.
• Take ownership of your software designs and ensure they are developed in line with specifications for our high-speed die bonding and die sorting equipment (pick and place equipment) in line with project deadlines.
• Develop software based on our API’s (among others for motion, vision, and I/O) or external libraries like OpenCV.
• Join the Agile scrum and technical meetings.
• Participate in document and code reviews.
• Join the development of best-in-class die bonder applications running with 100 threads in parallel to control over 40

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Job Qualifications:

• BSc or MSc degree in Embedded Systems, Informatics, Computer Science or Electronics.
• Approximately 2 years + experience in Embedded Software engineering with C++ or similar object-oriented languages.
• Experience with design methodologies like UML diagraming.
• Knowledge of real time systems, SW control of electronics and control systems.
• Experience in equipment and automation technologies is a plus.
• Ability to work in a multi-functional team.
• You have good analytical skills and hands-on mentality.
• You have a broad interest in high-tech equipment and automation technologies, not limited to the software domain only.
• Willing to travel occasionally to our customers in Asia (2 times a year).