ITEC is expanding its high-speed die bonding and die sorting equipment portfolio to serve new market segments in semiconductor assembly. The R&D team is designing and developing new modules and systems that will subsequently be developed, assembled, tested and released for series production.
Do you want to be the Mechanical Design Lead in the development of mechanical designs for ITEC’s high-speedpick & place assembly equipment? Do you get energy from working in a multi-disciplinary team to drive for high quality results?
Join our team and you will have the opportunity to be part the exciting journey that ITEC is undertaking in becoming a world leader in semiconductor assembly equipment and automation solutions. We offer a culture where your initiatives, feedback and ideas matter and we offer extensive learning and future career opportunities where you can grow either on the technical ladder, project management or line management ladder.