Package Analysis Engineer





NXP Semiconductors N.V. (NASDAQ: NXPI) provides High Performance Mixed Signal and Standard Product solutions that leverage its leading RF, Analog, Power Management, Interface, Security and Digital Processing expertise. These innovations are used in a wide range of automotive, identification, wireless infrastructure, lighting, industrial, mobile, consumer and computing applications. A global semiconductor company with operations in more than 35 countries, over 45.000 employees and a revenue of over $10 billion.
Product Diagnostic Center(PDC) Nijmegen is well recognized as Best-in-class Digital & Analog Failure Analysis and Material Analysis support. Package Analysis team is providing package and board level failure analysis and provide circuit access and sample preparation support to enable in-die electrical failure analysis. We are working closely with business partners, Package/Front-End Innovation, Fabrication and Assembly and Test sites. We are a diversified team with high energy, an open collaboration environment and eagerness for continuous improvement.

Wat vragen wij

Failure Analysis Engineer



The Package Analysis Engineer takes a role in development of new diagnostics procedures at package level. He/she works in close cooperation with the product development teams within NXP worldwide to develop FA methods for both circuit access and package analysis using his knowledge of material science and assembly technology. Supports re-packaging of failing products into a simpler or more suitable package for fault localization in close cooperation with the Sample Center Nijmegen. He/she is also responsible for deploying these procedures into general practice by training and coaching of FA engineers worldwide.

The Package Analysis Engineer participates in worldwide organized multidisciplinary teams. To be effective, a strong and broad technical background and experience is required. This spans across the experience of materials properties (electrical, chemical, thermo-mechanical) and their interaction in assemblies over IC lifetime as well as experience in assembly of semiconductor devices (bonding, packaging) and/or Failure Analysis.

Applying of advanced failure analysis methods/tools; chemical and mechanical decapsulation (frontside as well as backside), X-ray, SEM-EDX, planar polishing, preparation and making of mechanical cross-sections and re-packaging knowledge is asked on daily base.

A key aspect for the Package Analysis Engineer is the communication with all parties involved. Moreover, he/she may be expected to lead multi-functional and/or cross-organizational teams. Responsibilities include not only the use of existing and available equipment, techniques and methods, but also development of new methods and techniques.


• Bachelor in Chemistry/Electrical/Mechanical
• 1+ years of experience in the field
• Analytical thinker, creative, taking initiative, high drive and result oriented with the ambition to become a specialist in this area
• Hands-on experience in chemical lab is needed

Softs kills
• Strong in communication, interaction, presentation and reporting.
• Good command of spoken and written English language
• Good organizational skills, project leader skills and high level of independence.
• Flexible in working off-office hours to assure realizing commitments
• Team player

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