Our client is expanding its high-speed die bonding and die sorting equipment portfolio to serve new market segments in semiconductor assembly. The R&D team is designing and developing new modules and systems that will be subsequently developed, assembled, tested and released for series production.
1 year assignment (temp to perm - possible take over after 12 months).
What you will do
core of this role:
PCB's, Cabling, industrial PC's and motion control hardware etc in AUTOCAD or Eplan
What you will need