Nijmegen
12-10-2023
The IC Package Development / Assembly Engineer Technical will lead the development of our package portfolio, supporting NPI from concept through production release. He will provide direction to product- and design engineers for optimum performance while ensuring, cost effective and well manufacturable packaging solutions. Next to this will he guide our OSAT’s and support our Proto Line from initial sampling to high volume manufacturing. Package types include plastic molded leadframe packages, ceramic packages and air cavity plastic packages for high power RF and Microwave IC’s.
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