IC Package Development / Assembly Engineer

Functieomschrijving

• Developing Backend Assembly Process and/or Package Developments for RF Power products as Technical Lead or Project Manger
• Work with Product Design, Quality & Reliability, Failure Analysis, Supply Chain, and our OSAT’s to develop and qualify packaging technologies and assembly processes, with focus on performance, cost (DFM), and quality
• Guidance of the design community in package/material sections and support in initial sample making (proto-line)
• Creation, regular review and updating of design & equipment process FMEA and control plans and design rules
• Technical support on Manufacturing with troubleshooting and providing technical solution
• Perform continuous improvement activities of existing assembly processes, equipmentand materials for yield & quality improvements as well as cost savings
• First point of contact towards OSAT’s for technical aspects

Functie-eisen

• BS, MS and PhD preferably in Chemistry, Organic Chemistry, Chemical Engineering, Material Engineering, Material Science, Applied Science, or other relevant qualification
• Minimum 5+ years of relevant experience in the function of package and assembly process development such as die attach, SMT, Lid attach, wire bonding and molding
• Possess in depth technical knowledge and hands on experience on semiconductor backend assembly processes for RF Power Packages
• Hands on experience on engineering methods such as FMEA/DFMEA/PFMEA, SPC, Pareto Analysis, Control Charts, 8D methodology and DoE.
• Proven experience in project management, document accurately, communicate with intention, report efficiently, pre-empt risk, and drive for the best possible outcome for the customer, for the company, and for the team members
• Solid experience and technical understanding in semiconductor reliability standards and test methods
• Experience in materials characterization and analysis, DOE, reliability standards, and FA technique is preferred
• Experience in low, medium and high-volume manufacturing for high RF Power Products is preferred
• Extensive experience in collaborating and driving OSATs in all stages of process development and technology transfer
• Strong background in statistical analysis and proficient in the use of statistical analysis software packages such as JMP
• Familiar with design tools such as AutoCad or other design tools
• Good analytical and problem solving skills with a keen attention to details
• Excellent written and verbal communication skills (English)
• Ability to thrive in a fast-paced, result oriented growth business
• Ability to work in the situation with uncertainty with minimum guideline